E&R Engineering Corp. has announced the launch of its innovative “E-Core System” during an event held in Taipei, Taiwan. This groundbreaking initiative, which blends the strengths of “E&R” and “Glass Core,” signifies the creation of the “Glass Substrate Supplier E-Core System Alliance.” This strategic alliance aims to merge expertise to deliver comprehensive solutions in the advanced packaging sector, particularly focusing on glass substrates, to both domestic and international markets.
Strategic Alliance for Next-Generation Packaging
The E-Core Alliance comprises several industry leaders, including Manz AG, Scientech, ShyaWei Optronics, Lincotec, STK Corp., Skytech, and Group Up. These companies specialize in wet etching, AOI optical inspection, sputtering, and ABF lamination equipment.
The alliance also benefits from the involvement of key component suppliers, including HIWIN, HIWIN Mikrosystem, Keyence Taiwan, Mirle Group, ACE PILLAR, CHD TECH, and Coherent. This collaborative effort positions E&R to lead the advancement of state-of-the-art glass substrate technology in Taiwan, refining processes and expanding partnerships to foster innovation.
Rising Demand for Glass Substrates in Advanced Technologies
As the demand for AI chips and high-frequency communication devices accelerates, glass substrates have emerged as a critical component in advanced packaging technologies. Unlike traditional copper foil substrates, glass substrates offer superior wiring density and signal performance. Their inherent flatness, coupled with high-temperature and voltage tolerance, makes them a preferred alternative in the industry.
Innovations in Glass Substrate Manufacturing
The manufacturing process for glass substrates includes several intricate steps such as glass metallization, ABF (Ajinomoto Build-up Film) lamination, and substrate cutting. Key processes like Through-Glass Via (TGV), wet etching, AOI, sputtering, and plating play a vital role in achieving the desired specifications. E&R Engineering Corp. has played a pivotal role in pioneering these technologies, especially in the essential initial phase of glass laser modification (TGV).
Although glass laser modification technology was introduced over a decade ago, its slow processing speed had previously hindered mass production, achieving only 10 to 50 vias per second. E&R Engineering Corp., in collaboration with a North American IDM customer, has spent the past five years perfecting this technology. In 2023, following a stringent validation phase, E&R successfully reached speeds of up to 8,000 vias per second for fixed patterns, and between 600 to 1,000 vias per second for customized patterns. This significant advancement, coupled with an accuracy of +/- 5 μm meeting the 3 sigma standard, has positioned glass substrates as a viable option for mass production.
Showcasing Innovations at SEMICON Events
E&R Engineering Corp. is set to showcase its latest technological advancements at SEMICON Taiwan 2024 and SEMICON Europa 2024. Attendees will have the opportunity to explore these cutting-edge developments in glass substrate technology at the following locations:
- SEMICON Taiwan 2024
- Location: Taipei Nangang Exhibition Center Hall 1
- Booth Information: 4F, #N0968
- Date: September 4-6, 2024
- SEMICON Europa 2024
- Location: Messe München
- Booth Information: C2622
- Date: November 12-15, 2024
E&R Engineering Corp. continues to lead the industry with its innovative solutions, driving the mass adoption of glass substrates in the semiconductor and advanced packaging sectors.
