Samsung Electronics Co., Ltd., a global leader in advanced memory technology, has begun mass production of its thinnest LPDDR5X DRAM packages. These new 12-nanometer (nm)-class, 12-gigabyte (GB) and 16GB packages are the slimmest in the industry, reinforcing Samsung’s leadership in low-power DRAM technology.
Innovative Thin Packaging
Samsung’s new LPDDR5X DRAM packages stand out for their ultra-thin design. This design creates additional space within mobile devices, enhancing airflow and thermal management. Such improvements are vital for high-performance applications, including on-device AI. The new packages feature a 4-stack design, reducing their thickness by approximately 9% compared to earlier models. They also offer 21.2% better heat resistance.
Enhanced Performance and Efficiency
At just 0.65 millimeters thick, these DRAM packages are the thinnest available for 12GB modules or above. Samsung achieved this reduction through advanced printed circuit board (PCB) and epoxy molding compound (EMC) techniques. The company also optimized its back-lapping process to minimize package height. These innovations provide superior performance while maintaining a compact form factor, enhancing device efficiency and battery life.
Commitment to Innovation
YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, stated, Our LPDDR5X DRAM establishes a new standard for on-device AI capabilities. We are dedicated to continuous innovation, collaborating closely with our customers to meet future needs in the low-power DRAM market.
Future Expansion Plans
Samsung plans to expand its low-power DRAM market by supplying the 0.65mm LPDDR5X DRAM to mobile processor makers and device manufacturers. As demand for high-performance, high-density mobile memory solutions increases, Samsung aims to develop even more advanced modules. The company will introduce 6-layer 24GB and 8-layer 32GB DRAM packages, pushing the limits of thin packaging further.
Samsung’s new LPDDR5X DRAM packages advance the limits of memory technology. They offer a slim profile and high performance, meeting the needs of modern mobile devices, particularly those with on-device AI capabilities.
